Wang Xuran, Feng Xiaoming, Wang Zhong. Preparation of Fe-SiCp Compound Electroplate Friction Layer[J]. Special Casting & Nonferrous Alloys, 2006,(9):587-589.
Wang Xuran, Feng Xiaoming, Wang Zhong. Preparation of Fe-SiCp Compound Electroplate Friction Layer[J]. Special Casting & Nonferrous Alloys, 2006,(9):587-589.DOI：
复合电铸Fe-SiCp摩擦层的制备工艺
摘要
在Q235钢表面上复合电铸一层铁基SiCp摩擦材料
探讨了镀液中SiCp的质量浓度、电流密度、pH值及镀液温度对电铸层组织与性能的影响。结果表明
当镀液中SiCp的质量浓度为35g/L
电流密度为3.5A/dm2时
复合电铸摩擦层的干摩擦因数在0.55
0
.60之间
磨损率小于0.42×10-7cm3/J
达到了摩擦材料要求。
Abstract
Q235-SiC
p
surface wear-friction composites have been prepared by compound electroplate processing. The effects of concentration of SiCp in plating solution
current density
average pH and temperature of plating solution on microstructure and properties of the electroplated layer were investigated. The results show that the dry friction coefficient of electroplated layer is in the range of 0.55
0
.60
and its wear rate is less than 0.42×10
-7 cm
3
/J with the concentration of 35 g/L of SiC
p
in plating solution and current density of 3.5 A/dm
2
which can meet the requirements of friction materials.
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