The hot deformation behavior and microstructure of the Cu-Se-Bi alloy were investigated by thermal compression with Gleeble-1500 machine with the deformed temperature in range of 550 ℃ to 700 ℃ and strain rate at 0.01

1

0 s-1

and the constitutive equation for the hot deformation behavior has been established based on the experimental data.The results reveal that the dynamic recrystallization at high temperature in Cu-Se-Bi alloy can remarkably decrease the flow stress which tends to a constant value with 15%

8

0% deformation rate.The fluctuant of the flow stress can be observed with the strain rate in range of 2.5 s-1 to 10 s-1

in which the maximum fluctuant value of 12 MPa can be observed with strain rate of 10 s-1 and true strain of 0.01

0

.15 at 700 ℃.The recrystallization is increased with the increase of the strain

and the grain size is decreased with the decrease of strain rate.The average grain size of 8.5 μm can be obtained with the strain of 60% and strain rate of 0.01 s-1 at 600 ℃.