基体偏压对磁控溅射AlSn20镀层组织形貌与性能的影响

郭巧琴; 蒋百灵; 李建平; 吴兵

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基体偏压对磁控溅射AlSn20镀层组织形貌与性能的影响
Effects of Substrate Bias Voltage on Morphologies and Properties of Al-20Sn Coating Deposited by Non-equilibrium Magnetron Sputtering
2011年31卷第4期页码：308-310
纸质出版日期： 2011 ，
DOI：

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[1]郭巧琴,蒋百灵,李建平,吴兵.基体偏压对磁控溅射AlSn20镀层组织形貌与性能的影响[J].特种铸造及有色合金,2011,31(04):308-310+394.

Guo Qiaoqin1, Jiang Bailing1, Li Jianping2, et al. Effects of Substrate Bias Voltage on Morphologies and Properties of Al-20Sn Coating Deposited by Non-equilibrium Magnetron Sputtering[J]. Special Casting & Nonferrous Alloys, 2011,31(4):308-310.
[1]郭巧琴,蒋百灵,李建平,吴兵.基体偏压对磁控溅射AlSn20镀层组织形貌与性能的影响[J].特种铸造及有色合金,2011,31(04):308-310+394. DOI：

Guo Qiaoqin1, Jiang Bailing1, Li Jianping2, et al. Effects of Substrate Bias Voltage on Morphologies and Properties of Al-20Sn Coating Deposited by Non-equilibrium Magnetron Sputtering[J]. Special Casting & Nonferrous Alloys, 2011,31(4):308-310. DOI：

摘要

采用非平衡磁控溅射在铝基轴承合金表面制备了AlSn20镀层

分析不同基体偏压对AlSn20镀层的组织形貌、硬度、膜基结合力、摩擦因数等的影响。结果表明

非平衡磁控溅射AlSn20镀层

基体偏电压在-60～-120V范围内

镀层呈层状生长

随着基体偏电压增大

镀层由粗大结构向细晶结构变化

镀层硬度与基体偏电压成反比

当偏电压为-120V时

镀层硬度（HV0.025）最高为80

镀层与基体结合力最高可达35N

镀层的摩擦因数最低为0.15。

Abstract

The Al-20Sn coatings on aluminum bearing alloy were deposited by magnetron sputtering technology.Effects of substrate bias voltages on microstructure

hardness

bonding strength and frictional coefficient of the coatings were analyzed.It is found that coating exhibits lamellar growth with substrate bias voltage at-60～-120V.With increasing in substrate bias voltage

film structure is transformed from coarse structure to fine one.Hardness of the coatings is inversely proportional to the substrate bias voltage.With substrate bias voltage of-120V

hardness

bonding strength between coating and the substrate and frictional coefficient reach up to HV80

35N and 0.15

respectively.